3月11日消息，据外媒报道，东部高科确认量产Foveon公司的增强型CMOS图像传感器芯片，并命名为X3 Quattro。该芯片将用于适马（Sigma）的DP2 Quattro相机。
该传感器采用像素堆叠结构，采用三层结构识捕捉4.9MP-19.6MP的色彩信息。这将使亮度比高于色彩比，与传统的“拜耳”传感器类似。
适马DP2 Quattro作为新相机产品线第一次试水，DP1、DP3等型号也将纳入东部高科X3 Quattro图像传感器芯片生产范围。（元器件交易网毛毛 译）
以下为原文：
Dongbu HiTek has confirmed volumeproduction of Foveon's enhanced CMOS image sensor chips (CIS), named X3Quattro. The chips are being deployed in the compact dp2 Quattro camera fromSigma.
The sensor is built with a pixel-stackingarchitecture. It identifies colour information using three layers, capturing19.6MP resolution at the top, but only 4.9MP each at the lower levels. Thismakes for a luminance resolution higher than the colour resolution, which issimilar to conventional "Bayer" sensors.
The possible loss of a little colourresolution notwithstanding, Dongbu HiTek Marketing EVP Jae Song said,"Compared to prior sensor designs, this [X3 Quattro] represents a 30 percent increase in pixel detail without the need to increase chip size."
As the first entry in this new camera line,Sigma's dp2 Quattro will soon be followed by dp1 and dp3 models alsoincorporating X3 Quattro CIS chips manufactured by Dongbu HiTek.
