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  • 香港研发者开发倒装芯片下凸点金属镀层技术
    http://www.ic72.com 发布时间:2007/4/16 8:40:00
     Chingho Philip Chan and Guowei David Xiao, both of Kowloon, Hong Kong, have developed under-bump metallization layers and electroplated solder bumping technology for flip-chip.

            According to the U.S. Patent & Trademark Office, the invention relates to a "series of improved processes and methods to manufacture solder bumps on the wafer which shrink the space among solder bumps and reduce the cost of manufacturing. A design method and a relevant manufacturing process are introduced to form an organic material or metal material layer, which is called a Bump-Reflow-Control Layer. The pad patterns can be defined by this method. A mechanical part is designed with a hermetic cover to improve the photoresist process. The series of photolithography process including the designing method of related photolithography mask is introduced to achieve the high quality and thick photoresist."


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